Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
| Author | : Erdogan Madenci |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 201 |
| Release | : 2012-12-06 |
| ISBN-10 | : 9781461502555 |
| ISBN-13 | : 1461502551 |
| Rating | : 4/5 (55 Downloads) |
Book excerpt: Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
