Related Books
Language: en
Pages: 798
Pages: 798
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
Language: en
Pages: 484
Pages: 484
Type: BOOK - Published: 2014-07-21 - Publisher: John Wiley & Sons
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate d
Language: en
Pages: 0
Pages: 0
Type: BOOK - Published: 2012-10-22 - Publisher: John Wiley & Sons
The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics into perspective with t
Language: en
Pages: 488
Pages: 488
Type: BOOK - Published: 2019-05-06 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Language: en
Pages: 265
Pages: 265
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate