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Pages: 381
Pages: 381
Type: BOOK - Published: 2019-04-03 - Publisher: Springer
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different funct
Language: en
Pages: 542
Pages: 542
Type: BOOK - Published: 2023-03-27 - Publisher: Springer Nature
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and e
Language: en
Pages: 304
Pages: 304
Type: BOOK - Published: 2000 - Publisher: SPIE Press
Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconn
Language: en
Pages: 182
Pages: 182
Type: BOOK - Published: 2018-03-12 - Publisher: Springer
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experie
Language: en
Pages: 461
Pages: 461
Type: BOOK - Published: 2022-12-08 - Publisher: Springer Nature
To provide ubiquitous and various services, 6G networks tend to be more comprehensive and multidimensional by integrating current terrestrial networks with spac