Area Array Packaging Handbook
Download or Read eBook Area Array Packaging Handbook PDF written by Ken Gilleo and published by McGraw Hill Professional. This book was released on 2002 with total page 832 pages. Available in PDF, EPUB and Kindle.
| Author | : Ken Gilleo |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 832 |
| Release | : 2002 |
| ISBN-10 | : UOM:39015053514967 |
| ISBN-13 | : |
| Rating | : 4/5 (67 Downloads) |
Book Synopsis Area Array Packaging Handbook by : Ken Gilleo
Book excerpt: *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
