Area Array Packaging Processes

Download or Read eBook Area Array Packaging Processes PDF written by Ken Gilleo and published by McGraw Hill Professional. This book was released on 2004 with total page 276 pages. Available in PDF, EPUB and Kindle.

Author	: Ken Gilleo
Publisher	: McGraw Hill Professional
Total Pages	: 276
Release	: 2004
ISBN-10	: 0071428291
ISBN-13	: 9780071428293
Rating	: 4/5 (91 Downloads)

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Book Synopsis Area Array Packaging Processes by : Ken Gilleo

Book excerpt: This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.

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This engineering reference covers the most important assembly processes in modern electronic packaging.